Products
Thermal Materials
Thermal Interface Materials (TIMs)
EMI Shielding and Grounding Tapes
PolyfluidTM TGL Series Thermally Conductive Gel is a pre-curing and compliant thermal interface material. And the material can conform to multiple component heights, and offer excellent thermal performance and low contact thermal resistance.
| Item | Unit | TGL30 | TGL60 | TGL120 | TGL150 | Test Method |
| Composition | / | Silicone Gel & Ceramic | / | |||
| Color | / | White | White | Gray | Gray | Visual |
| Density | g/cm³ | 2.6 | 3.3 | 3.4 | 3.5 | ASTM D792 |
| Thermal Conductivity | W/m·K | 3.3 | 6.0 | 12.0 | 15.0 | ASTM D5470 |
| Thermal Expansion | ppm/℃ | 100 | 140 | 100 | 100 | ASTM E831 |
| Dielectric Strength | KV/mm | >6 | >6 | >6 | >6 | ASTM D149 |
| Volume Resistivity | Ω·mm | >10¹⁴ | >10¹⁴ | >10¹⁴ | >10¹⁴ | ASTM D257 |
| Weight Loss | % | 0.6 | 0.3 | 0.3 | 0.3 | @150℃, 24H |
| Minimum Bondline Thickness | mm | 0.07 | 0.5 | 0.2 | 0.2 | SG Internal |
| Continuous Use Temperature | ℃ | -56~180 | / | |||
