Products
Thermal Materials
Thermal Interface Materials (TIMs)
EMI Shielding and Grounding Tapes
1-C Thermal Silicone Gel
Compared with the two-component thermal gels, one-component thermal gels and has a longer operating time at room temperature and easier processability.
|
Item |
Unit |
TGL30 |
TGL45 |
TGL60 |
TGL80 |
Test Method |
|
Color |
/ |
Yellow |
Yellow |
Grey |
Grey |
Visual |
|
Flow rate |
g/min |
60 |
50 |
45 |
18 |
SG method |
|
Density |
g/cm3 |
2.9 |
3.2 |
3.2 |
3.3 |
ASTM D792 |
|
Tack-free time@23℃ |
h |
＞48 |
＞48 |
＞48 |
＞48 |
SG method |
|
Thermal conductivity |
W/m·k |
3 |
4.5 |
6.1 |
8 |
ASTM D5470 |
|
Thermal resistance |
oC*cm2/W |
2.7 |
1.9 |
1.3 |
1.1 |
ASTM D5470 |
|
Tensile strength |
MPa |
0.2 |
0.18 |
0.22 |
0.17 |
ASTM D412 |
|
Oil seepage rate |
% |
0.8 |
0.6 |
0.5 |
0.4 |
SG method |
|
Sag test @1.5mm |
mm |
0.0 |
0.0 |
0.0 |
0.0 |
SG method |
|
Dielectric strength |
KV/mm |
6 |
6 |
6 |
6 |
ASTM D149 |
|
Volume resistivity |
Ω·cm |
1013 |
1013 |
1013 |
1013 |
ASTM D257 |
|
Flammability rating |
/ |
V0 |
V0 |
V0 |
V0 |
UL 94 |
|
Operating temperature |
oC |
-40~180 |
-40~180 |
-40~180 |
-40~180 |
/ |
|
Storage conditions |
/ |
＜0℃ |
＜0℃ |
＜0℃ |
＜0℃ |
/ |
Note: TGL series products should be thawed at room temperature for more than 30 minutes before use.
TGLS is series of none-curing thermal conductive that will not solidify, does not sag and has low oil leakage.
|
Item |
Unit |
TGL20S |
TGL35S |
TGL60S |
TGL80S |
Test Method |
|
Color |
/ |
Yellow |
Yellow |
Grey |
Grey |
Visual |
|
Flow rate |
g/min |
90 |
65 |
45 |
20 |
SG method |
|
Density |
g/cm3 |
2.3 |
3 |
3.2 |
3.3 |
ASTM D792 |
|
Thermal conductivity |
W/m·k |
3 |
4.5 |
6.1 |
7.8 |
ASTM D5470 |
|
Sag test @1.5mm |
mm |
0.0 |
0.0 |
0.0 |
0.0 |
SG method |
|
Oil seepage rate |
mm |
1.6 |
1.8 |
1.7 |
2.2 |
SG method |
|
Dielectric strength |
KV/mm |
6 |
6 |
6 |
6 |
ASTM D149 |
|
Volume resistivity |
Ω·cm |
1013 |
1013 |
1013 |
1013 |
ASTM D257 |
|
Flammability rating |
/ |
V0 |
V0 |
V0 |
V0 |
UL 94 |
|
Operating temperature |
oC |
-40~180 |
-40~180 |
-40~180 |
-40~180 |
/ |
|
Storage conditions |
/ |
Room temperature |
/ |
|||
Two-component Thermal Gel
The dual chamber cartridge, with a mixing tube, will allow the A and B components to mix homogenously during dispensing. The material curing can be accelerated by heat and can be stored for a long time at room temperature with low oil permeability and without sag.
|
Item |
Unit |
TGL20D |
TGL35D |
TGL60D |
TGL80D |
Test Method |
|
Color A/B |
/ |
AYellow/BWhite |
AYellow/BGrey |
Visual |
||
|
Density |
g/cm3 |
2.4 |
3 |
3.2 |
3.3 |
ASTM D792 |
|
Tack-free time@23℃ |
h |
1 |
1 |
1 |
1 |
SG method |
|
Curing time@130℃ |
g/min |
5 |
6 |
6 |
7 |
SG method |
|
Thermal conductivity |
W/m·k |
2 |
3.5 |
6.1 |
8.2 |
ASTM D5470 |
|
Sag test @1.5mm |
mm |
0.0 |
0.0 |
0.0 |
0.0 |
SG method |
|
Tensile strength |
MPa |
0.22 |
0.2 |
0.2 |
0.17 |
ASTM D412 |
|
Oil seepage rate |
% |
0.8 |
0.6 |
0.5 |
0.6 |
SG method |
|
Dielectric strength |
KV/mm |
6 |
6 |
6 |
6 |
ASTM D149 |
|
Volume resistivity |
Ω·cm |
1013 |
1013 |
1013 |
1013 |
ASTM D257 |
|
Flammability rating |
/ |
V0 |
V0 |
V0 |
V0 |
UL 94 |
|
Operating temperature |
oC |
-40~180 |
-40~180 |
-40~180 |
-40~180 |
/ |
Silicon-free Thermal Gel
TGL60SF is made of non-silicon polymer materials as the matrix to avoid applications sensitive to silicone.
Features
|
Item |
Unit |
TGL60SF |
Test Method |
|
Color |
/ |
Grey |
Visual |
|
Flow rate@85psi |
g/min |
15 |
SG method |
|
Density |
g/cm3 |
3.2 |
ASTM D792 |
|
Thermal conductivity |
W/m·k |
6 |
ASTM D5470 |
|
Sag test @1.5mm |
mm |
0.0 |
SG method |
|
Oil seepage rate |
mm |
0 |
SG method |
|
Dielectric strength |
KV/mm |
6 |
ASTM D149 |
|
Volume resistivity |
Ω·cm |
1013 |
ASTM D257 |
|
Flammability rating |
/ |
V0 |
UL 94 |
|
Operating temperature |
oC |
-40~150 |
/ |
|
Storage conditions |
/ |
Room temperature |
/ |
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