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Home > Products > Thermal Materials > Thermal Interface Materials (TIMs) > TCP Series Thermally Conductive Putty
TCP Series Thermally Conductive Putty
PolyplateTM TCP Series Thermally Conductive Putty is a soft and compliant gap filler material with the thermal conductivity of 8.0 W/m·K. It can offer exceptional thermal performance at low pressure.
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