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Home > Products > Thermal Materials > Thermal Interface Materials (TIMs) > TSP-G Series Conductive Silicone Thermal Pad
TSP-G Series Conductive Silicone Thermal Pad
PolyplateTM TSP-G Series Silicone-Based Thermal Pad is filled with carbon fibers in high density through the thickness of a polymer matrix. It has ultra-high thermal conductivity of 15W/m·K and 20W/m·K. It also offers high compressibility, softness, and flexibility.

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