Packaging Adhesive Film
High anti-PID, POE, suitable for
packaging of high-reliability
components for more than 35 years
Positioning Tape
Anti-merger, good concealment,
UV resistance
Interconnection Electrode
Low yield, high tensile strength,
ultra-low wire diameter,
low-temperature welding
Busbar Electrode
Low yield, high tensile strength,
ultra-low wire diameter,
low-temperature welding
Insulation Seal
High reliability, cost-effective and easy process
Packaging Adhesive Film
EVA design, multi-layer design
Edge Banding
Water-blocking Tape
Good performance of bonding,
water barrier and weather
resistance
POE
High anti-PID, high resistance,
high cross-linking, no bubbles,
anti-merger
Interconnection Electrode
Low yield, high tensile strength,
ultra-low wire diameter,
low-temperature welding
Positioning Tape
Anti-merger, good concealment,
UV resistance
Insulation Seal
High reliability, cost-effective and easy process
RFID Label
Component information
identification, good UV
resistance
Follow and share
