Products
Foam Materials
Thermal Interface Materials (TIMs)
EMI Shielding and Grounding Tapes
Polyplate™ Microcellular Polymer Foam S3 Series is a medium soft, quick rebound foam for cushioning, protective sealing, and long-term gap filling in electronic devices. S3 Series foam has very low compression set, high sealing performance, and excellent impact absorption.
| P/N |
Thickness With Liner (mm) |
Density (kg/m³) |
25% Compression Force Deflection (psi) |
Compression Set (%) |
Suggested Max. Compression Ratio (%) |
Dimensional Stability (%) |
Continuous Use |
|---|---|---|---|---|---|---|---|
| PF030-S3 | 0.3 | 320 | 16.55 | <3 | 50 | ±2 | 70 |
| PF050-S3 | 0.5 | 320 | 16.55 | <3 | 50 | ±2 | 70 |
| PF070-S3 | 0.7 | 320 | 16.55 | <3 | 50 | ±2 | 70 |
| PF100-S3 | 1.0 | 320 | 16.55 | <3 | 50 | ±2 | 70 |
| PF150-S3 | 1.5 | 320 | 16.55 | <3 | 50 | ±2 | 70 |
| PF200-S3 | 2.0 | 320 | 16.55 | <3 | 50 | ±2 | 70 |
| PF300-S3 | 3.0 | 320 | 16.55 | <3 | 50 | ±2 | 70 |
| Test Method | ASTM D3574 | ASTM D3574 | ASTM D3574 | SAE J-2236 |
Note: The thickness can be customized by request
