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Thermal Activated Tape
Thermal Activated Tape
Thermal Activated Tape
SG offers a variety of adhesive tapes made of PET, Non-woven, Foam, PI substrates coated with acrylic, silicone, rubber, hot melting, thermal transform adhesive. Available in variety of widths, lengths and release liners for specific needs, designed for special environment in industry, commerce and family applications.
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Label Materials

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Thermalplastic Bonding Film

Product
P/N 		Adhesive
Type 		Total
Thickness
(um) 		Type Carrier Bonding
strength
MPa
SUS/SUS 		Soft
Point
(℃) 		Color Adhesive Type Recommended
Bonding
Conditions 		Recommended
Adherant 		Containing
PFAS or
Sulfide
(Y/N) 		Tackiness
(Y/N) 		Storage
Conditions 		Feature/Application
TL0050WP TPU 50 Double
-sided 		Non >2 40-60 White Thermalplastic Bonding:
60-90°C,1-5
Bar, 5-60 s 		PC, PET, FR4,
PA, Ink-glass,
SUS, Artificial
leather and other
verified
substrates 		N N <30℃,
50%RH, 12
months 		1. Extremely strong bonding
for leather, PC. PET, FR4,
PA etc.
2.Activated at low
temperature and pressure
3. With SG DA 333 primer
can have good adhesion to
SUS, Aluminum
TL0051WP TPU 50 Non >2 70-90 White Thermalplastic Bonding:
80-110°C, 1-5
Bar,5-60 s 		N N
TL0060WP TPU 60 Non >2 50-70 White Thermalplastic Bonding:
70-110°C, 1-5
Bar, 5-60 s 		N N
TL5005 SBS 50 Non >1 / White Thermalplastic PC, PET, FR4,
PA, Ink-glass,
SUS, AL,
Artificial leather
and other
verified
substrates 		N Y 1. Extremely strong peel
strength
for leather, PC, PET, FR4,
PA etc.
2.Activated at low
temperature and pressure
TL5010 SBS 100 Non >1 / White Thermalplastic N Y
TL5020 SBS 200 Non >1 / White Thermalplastic N Y
TL5030 SBS 300 Non >1 / White Thermalplastic N Y



Thermalplastic Acrylic Bonding Film

Product
P/N 		Adhesive
Type 		Total
Thickness
(um) 		Type Carrier Bonding
strength
MPa
SUS/SUS 		Soft
Point
(℃) 		Color Adhesive Type Recommended
Bonding
Conditions 		Recommended
Adherant 		Containing
PFAS or
Sulfide
(Y/N) 		Tackiness
(Y/N) 		Storage
Conditions 		Feature/Application
TP3001
TP3002
TP3005 		Acrylic 10-50 Double
-sided 		None >2 90-120 Transparent Thermalplastic Glue Line
Temperature:
min.140°C
Dwell Time:
30-120 Seconds
Pressure:
2.8-5 Bar 		Metal, SUS,
Aluminum,
Glass, PI, FR-4,
and other
verified
substrates 		N N <30℃,
50%RH, 12
months 		1.Weak adhesion at room
temperature, good
adhesion to metal, glass
and PI after curing
2.Good impact
performance and
heat/moisture resistance
3.No further post-curing is
required after thermal
activation during bonding
4.Zero emissions, zero
VOC
5.Could suffer SMT
process



High Temperature Activation Bonding Film

Product
P/N 		Material
Type 		Total
Thickness
(um) 		Type Carrier Bonding
Strength
MPa
SUS/SUS 		Soft
Point
(℃) 		Color Adhesive
Type 		Recommended
Bonding
Conditions 		Recommended
Adherant 		Containing
PFAS or
Sulfide
Y/N 		Tackiness
Y/N 		Storage
Conditions 		Feature/Application
HT6501
HT6503
HT6505 		Nitrile-phenolic 10-50 Double-sided None >2 >60 Transparent Thermal
Setting 		Pre-bonding：
60-120°C, 3-5bar
5-30s;
Fin-bonding: 150-
180°C, 3-5bar 30-
360s 		Metal, SUS,
Aluminum,
Glass, PI, FR-4
and other
verified
substrates 		N N <30℃, 1
Year 		1. Good adhesion to metal,
glass and PI after curing
2. Good impact performance
and heat/moisture resistance
3. No further post-curing is
required after thermal activation
during bonding
4. Could suffer SMT process
HT2013P Epoxy 130 Single-sided PI/PET >7 >60 Amber/
Black 		Thermal
Setting 		Pre-bonding: 90-
120℃, 3-5Bar, 5-
30s; Fin-bonding:
160-180℃, 3-
5Bar, 5-15min 		N Y <5℃, 6
Months 		1. Electrical insulation
2. Cooling Plate
HT2303
HT2303M
HT2304
HT2304B-1
HT2306 		Epoxy 30-60 Adhesiv
e Film 		None >7 >60 Black/
Others 		Thermal
Setting 		120℃, 3-5Bar, 5-
30s; Fin-bonding:
160-180℃, 3-
5Bar, 5-15min 		N N <5℃, 6
Months 		1. High temperature resistance
after curing
2. Outstanding resistance
against chemicals
3. Good adhesion on metals,
glass, ceramic materials,
textiles, and polymer film after
curing
4. Easy handling performance
for die cutting
HT5601 Epoxy 10 Double-sided None >3 90-120 Transparent Thermal
Setting 		Pre-bonding: 90-
120℃, 3-5Bar, 5-
30s; Fin-bonding:
170-200℃, 3-
5Bar, 5-20min 		N N <5℃, 6
Months 		1. High temperature resistance
after curing
2. Outstanding resistance
against chemicals
3. Good adhesion on metals,
glass, ceramic materials,
textiles, and polymer film after
curing
4. Easy handling performance
for die cutting
5. Could suffer SMT process
HT5602 Epoxy 20 Double-sided None >4 90-120 Transparent Thermal
Setting 		Pre-bonding: 90-
120℃, 3-5Bar, 5-
30s; Fin-bonding:
170-200℃, 3-
5Bar, 5-20min 		N N
HT5610 Epoxy 100 Double-sided None >20 90-120 Transparent Thermal
Setting 		Pre-bonding: 90-
120℃, 3-5Bar, 5-
30s; Fin-bonding:
170-200℃, 3-
5Bar, 5-20min 		N N



Low Temperature Activation Bonding Film

Product
P/N 		Adhesive
Type 		Total
Thickness
(um) 		Type Carrier Bonding
Strength
MPa
SUS/SUS 		Soft
Point
(℃) 		Color Adhesive
Type 		Recommended
Bonding
Conditions 		Recommended
Adherant 		Containing
PFAS or
Sulfide
Y/N 		Tackiness
Y/N 		Storage
Conditions 		Feature/Application
LT0100B PU 100 Double-sided None >5 45-60 Black Thermal
Setting 		Pre-bonding:
50-70℃, 3-
5Bar, 5-30s.
Fin-bonding: 75-
120℃, 3-5Bar,
0.5-3.0min 		PC, Ink-glass,
FR-4, SUS,
Artificial
leather and
other verified
substrates 		N N <30℃,
50%RH, 6
Months 		1. Extremely strong bonding
for leather, PC, SUS (with primer),
Aluminum (with Primer), etc.
2. Activated at low
temperature and pressure
3. Thermal setting type, can't be
re-activated
4. With SG DA 333primer can
have good adhesion to SUS,
Aluminum
LT0050B PU 50 Double-sided None >5 45-60 Black
LT0100 PU 100 Double-sided None >5 45-60 White
LT0050 PU 50 Double-sided None >5 45-60 White
LAT5025B PU 250 Double-sided None >2 50-80 Black 1. Outstanding resistance against
heat and chemicals
2. Good adhesion on SUS (with
Primer), Aluminum (with Primer),
PC, Glass and black coating
Glass after activation
3. Easy handling performance for
die cutting
4. With SG DA 333primer can
have good adhesion to SUS,
Aluminum



Primer

Product
P/N 		Adhesive
type 		Color Density
（k)g/l 		Viscosity
/mPa.s 		Drying
Time 		Recommended
Application
Conditions 		Recommended
Adherant 		Containing
PFAS or
Sulfide
(Y/N) 		Tackiness
(Y/N) 		Storage
Conditions 		Feature/Application
DA333
Primer 		Solvent
Based
Polyurethane 		Black 1 15 RT 10-
15mins; 50
℃ about
1mins 		RT 10-15mins
50℃ about
1mins; coating
weigth 10-30gsm 		Metal,SUS,
Aluminum,
Glass,PET,PC
,PA,
PI,ABS,FR4 		N N <30℃，
50%RH, 12
months 		1.High drying speed; Suitable to surface treatment
of metal and polarity plastics.
2. Excellent wetting and adhesion performance to
normal substrats, such as Metal SUS, Aluminum,
Glass PET,PC ,PA, PI,ABS,FR4.
3. High bonding and compatibility to thermalplastic
TPU, TPA, TPPE, and thermal setting PU Heat Activate Bonding Film（HABF）,
Epoxy HABF and other verified HABF.




Electrical or Thermal Conductive Heat Activation Bonding Film

Product
P/N 		Adhesive
Type 		Total
Thickness
(um) 		Type Conductivity Carrier Bonding
Strength
MPa
SUS/SUS 		Soft
Point
(℃) 		Color Adhesive
type 		Recommended
Bonding
Conditions 		Recommended
Adherant 		Containing
PFAS or
Sulfide
(Y/N) 		Tackiness
(Y/N) 		Storage
Conditions 		Feature
/Application
EM20XX
Series 		Modified
Epoxy 		30-100 Double-sided <100/mΩ
(Vertical) 		Cu/
Conductiv
e Fabric
/None 		>5 >60 Brownish
Red or
Grey 		Thermal
Setting 		Pre-bonding:
60-120°C, 3-
5bar 5-30s
Fin-bonding:
150-180°C, 3-
5bar 30-360s 		Metal, SUS,
Aluminum,
Glass, PI , FR-4,
and other
verified
substrates 		PFAS N
Sulfide N 		N ≤5℃，
50%RH, 6
months 		1.High
temperature
resistance after
curing
2.Outstanding
resistance against
chemicals
3.Good adhesion
on metals, glass,
ceramic materials,
textiles, and
polymer film after
curing.
4.Easy handling
performance for
die cutting
5.Good
conductivity
EM23XX
Series 		Modified
Epoxy 		30-100 Double-sided >5 >60 Thermal
Setting 		N ≤5℃，
50%RH, 6
months
EMU23XX
Series 		Modified
Epoxy 		30-50 Double-sided >5 >60 UV
Setting 		70mW 365nm
LED@60sec 4-
5Bar 10-30secs,
RT 7days curing
or 120℃, 30min
(accelerating
curing) 		Y <25℃，
50%RH, 6
months
TMXXXX
Series 		Modified
Epoxy 		30-100 Double-sided K=1.0W
K=1.5W
K=2.0W 		None >7 >60 White Thermal
Setting 		Glue Line
Temperature:
170-200°C
Dwell Time: 5-30
min
Pressure: 2-5
Bar 		N ≤5℃，
50%RH, 6
months 		1.High
temperature
resistance after
curing
2.Outstanding
resistance against
chemicals
3.Good adhesion
on metals, glass,
ceramic materials,
textiles, and
polymer film after
curing.
4.Easy handling
performance for
die cutting
5.Good thermal
conductivity


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