Products
Foam Materials
Thermal Interface Materials (TIMs)
EMI Shielding and Grounding Tapes
Polyplate™ Microcellular Polymer Foam S1 Series is a super soft, slow rebound foam for cushioning, protective sealing and long-term gap filling in electronic devices. It can reach 60% compression ratio. S1 Series foam has very low compression set, high sealing performance, and excellent impact absorption.
| P/N |
Thickness with Liner (mm) |
Density (kg/m³) |
25% Compression Force Deflection (psi) |
Compression Set (%) |
Suggested Max. Compression Ratio (%) |
Dimensional Stability (%) |
Continuous Use Temperature (℃) |
|---|---|---|---|---|---|---|---|
| PF015-S1 | 0.3 | 200 | 1.35 | <3 | 60 | ±2 | 70 |
| PF050-S1 | 0.5 | 220 | 1.42 | <3 | 60 | ±2 | 70 |
| PF070-S1 | 0.7 | 220 | 1.42 | <3 | 60 | ±2 | 70 |
| PF100-S1 | 1.0 | 220 | 1.42 | <3 | 60 | ±2 | 70 |
| PF120-S1 | 1.2 | 220 | 1.42 | <3 | 60 | ±2 | 70 |
| PF150-S1 | 1.5 | 220 | 1.42 | <3 | 60 | ±2 | 70 |
| PF200-S1 | 2.0 | 250 | 1.59 | <3 | 60 | ±2 | 70 |
| Test Method | ASTM D3574 | ASTM D3574 | ASTM D3574 | SAE J-2236 |
Note: The thickness can be customized by request
