PF-S2 Series Microcellular Polymer Foam

Polyplate^TM Microcellular Polymer Foam S2 Series is a soft, slow rebound foam for cushioning, protective sealing,and long-term gap filling in electronic device applications. S2 Series foam has very low compression set, high sealing performance, and excellent impact absorption.

Tape Materials

Tapes

PSA for Foldable Screen

Removable Tape

EMl Tapes and Gaskets

Heat / UV Activation Bonding Film

Thermal Materials

Thermal Interface Materials (TIMs)

Thermal Spreading Sheet

Nano Thermal Insulation Film

EMI/EMC Materials

EMI Shielding and Grounding Tapes

Electromagnetic Wave Absorbing Solutions

Foam Materials

Polyurethane (PU) Foam

Acrylic Foam

Acrylic Foam PA Series

Water-Proof Foam

Light-Blocking Foam

Acoustic Damping Foam

Silicone Foam/Rubber

Conductive Foam

Ultra-soft Foam

Ultra-soft Foam Tape

Label Materials

Labels

Soft, Slow Rebound

Polyplate™ Microcellular Polymer Foam S2 Series is a soft, slow rebound foam for cushioning, protective sealing,and long-term gap filling in electronic device applications. S2 Series foam has very low compression set, high sealing performance, and excellent impact absorption.

P/N	Thickness With Liner (mm)	Density (kg/m3)	25% Compression Force Deflection (psi)	Compression Set (%)	Suggested Max. Compression Ratio (%)	Dimensional Stability (%)	Continuous Use Temperature (℃ )
PF015-S2	0.15	600	5.68	<3	20	±2	70
PF020-S2	0.20	650	4.97	<3	20	±2	70
PF030-S2	0.30	480	3.55	<3	35	±2	70
PF040-S2	0.40	400	2.56	<3	40	±2	70
PF050-S2	0.50	400	2.56	<3	40	±2	70
PF060-S2	0.60	400	2.56	<3	40	±2	70
PF070-S2	0.70	400	2.42	<3	45	±2	70
PF080-S2	0.80	400	2.42	<3	45	±2	70
PF100-S2	1.00	400	2.42	<3	45	±2	70
PF150-S2	1.50	320	2.13	<3	50	±2	70
PF200-S2	2.00	320	1.85	<3	50	±2	70
PF300-S2	3.00	320	1.85	<3	55	±2	70
Test Method		ASTM D3574		ASTM D3574		ASTM D3574	SAE J-2236

Note: The thickness can be customized by request

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