Products
Tape Materials
Thermal Interface Materials (TIMs)
EMI Shielding and Grounding Tapes
| P/N |
Thickness (um) |
Copper Surface Treatment |
Color | Carrier |
180° Peel Strength-SUS (N/25mm) |
Backing Resistance Xy- (ohms) |
Adhesive Resistance Xy- (ohms) |
Electrical Resistance z- (ohms) |
Shielding Efficiency (@1GHz) |
Feature |
|---|---|---|---|---|---|---|---|---|---|---|
| SG CFU045DB-S1 | 50 | Black Ink Coating | Black |
Conductive Non-woven Fabric |
15 | <0.1 | <0.1 | <0.05 | ≥60 |
|
| SG CFU045DN | 45 | Nickel Plating | Gray | 15 | <0.05 | <0.1 | <0.05 | ≥60 | ||
| SG CFU045DG | 45 | Gold Plating | Gold | 15 | <0.05 | <0.1 | <0.05 | ≥60 | ||
| SG CFU045DT-S1 | 45 | Tin Plating | Gray | 15 | <0.05 | <0.1 | <0.05 | ≥60 |
