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Home > Products > Thermal Materials > Thermal Interface Materials (TIMs) > TGL 20RE Bio-based Thermally Conductive Gel
TGL 20RE Bio-based Thermally Conductive Gel
SG offers a variety of adhesive tapes made of PET, Non-woven, Foam, PI substrates coated with acrylic, silicone, rubber, hot melting, thermal transform adhesive. Available in variety of widths, lengths and release liners for specific needs, designed for special environment in industry, commerce and family applications.
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Description

PolyfluidTM TGL 20RE Bio-based Thermally Conductive Gel is a new type of thermal interface material and is suitable for the electronic field with cooling requirements. The special structure imparts excellent water and chemical resistance to the thermally conductive gel, while at the same time having low volatility and improving the environment. This material can adapt to various component heights and has excellent thermal performance and low contact thermal resistance.ich

Features

  • Biobased and degradable gel
  • Low volatility
  • Good flowability and wettability for reducing thermal resistance effectively
  • Highly conformable to uneven and rough surfaces
  • Compliance with RoHS requirements
  • Long term stability and reliability
  • Compatible with automated dispensing equipment
  • Easy for assembly and reworkable

Applications

  • High power CPU & GPU
  • Optical device
  • Power conversion module
  • Power transistor
  • Server
  • Telecommunication device
  • High power LED lighting
  • Consumer electronics
  • Flat panel display

Typical Properties

Item Unit Typical Data Test Method
Composition - Methacrylate Esters & Ceramic Powder -
Color - White Visual
Denisty g/cm3 2 ASTM D792
Flow Rate(85psi @30cc tube) g/min 60 SG Method
Thermal Conductivity W/m.K 2 ASTM D5470
Hardness Shore A 80 ASTM D2240
Breakdown Voltage KV/mm 6 ASTM D149
Volumetric Resistivity Ω·cm 10¹³ ASTM D257
Flame Rating / V0 ASTM D149
Usage Temperature -50~180 -


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