Products
Thermal Materials
Thermal Interface Materials (TIMs)
EMI Shielding and Grounding Tapes
PolyplateTM TCP Series Thermally Conductive Putty is a soft and compliant gap filler material with the thermal conductivity of 8.0 W/m·K. It can offer exceptional thermal performance at low pressure.
| Item | Unit | TCP series | Test Method |
| Composition | / | Silicone & Ceramic | / |
| Color | / | Brown | Visual |
| Thickness | mm | 0.5~5.0 | ASTM D374 |
| Density | g/cm³ | 3.3 | ASTM D792 |
| Hardness | Shore 00 | 60±5 | ASTM D2240 |
| Dielectric Strength | KV/mm | >6.0 | ASTM D149 |
| Volume Resistivity | Ω·cm | >10¹¹ | ASTM D257 |
| Continuous Use Temperature | ℃ | -40~200 | / |
| Weight Loss | % | <0.5< /td> | @150℃240H |
| Flame Rating | / | V0 | UL 94 |
| Thermal Conductivity | W/m·K | 8 | ASTM D5470 |
| Dielectric Constant@1MHz | / | 6.6 | ASTM D150 |
