Products
Foam Materials
Thermal Interface Materials (TIMs)
EMI Shielding and Grounding Tapes
Polyplate™ Microcellular Polymer Foam S4 Series is a firm, quick rebound foam for cushioning, protective sealing, and long-term gap filling in electronic devices. S4 Series has very good abrasion resistance, high sealing performance, and excellent impact absorption. It can be used as a footpad.
| P/N |
Thickness With Liner (mm) |
Density (kg/m3 ) |
25% Compression Force Deflection (psi) |
Tensile Strength (Mpa) |
Compression Set (%) |
Continuous Use Temperature (℃ ) |
|---|---|---|---|---|---|---|
| PF050-S4 | 0.5 | 480 | 35.5 | 1.77 | 4 | 70 |
| PF100-S4 | 1.0 | 480 | 35.5 | 1.77 | 4 | 70 |
| PF150-S4 | 1.5 | 480 | 35.5 | 1.77 | 4 | 70 |
| PF200-S4 | 2.0 | 480 | 35.5 | 1.77 | 4 | 70 |
| PF500-S4 | 5.0 | 480 | 35.5 | 1.77 | 4 | 70 |
| Test Method | ASTM D3574 | ASTM D412 | ASTM D3574 | SAE J-2236 |
Note: The thickness can be customized by request
