Thermal Interface Materials (TIMs)
EMI Shielding and Grounding Tapes
| Characteristics | SG Low Modulus Foam Tape Series | ||||
|---|---|---|---|---|---|
| SG 85652S | SG 85754SS | SG 85766S | |||
| Color | Black | ||||
| Thickness(um) | 100 | 150 | 200 | ||
| Foam Carrier (um) | 50 | 80 | 100 | ||
|
180° Peel Strength (SUS*N/20mm)* |
Pressure | 0.1kg | 23 | 24 | 25 |
| 0.2kg | 23 | 24 | 25 | ||
| 0.5kg | 23 | 24 | 26 | ||
| 2.0kg(compare) | 23 | 28 | 35 | ||
| Loop Tack (N) | 27 | 23 | 26 | ||
| Young's lodulus-Z Direction)(%) | Pressures-50g | 12 | 2 | 9 | |
* Test method: ASTM D3330, 50um PET as backing
