Thermal Interface Materials (TIMs)
EMI Shielding and Grounding Tapes
| Items | SG 80315E | SG 80306E & SG 3109AF | |||
|---|---|---|---|---|---|
| EDS side | EDF side | ||||
| Thickness (um) | 150 | 60 | 90 | ||
|
180° Peel Strength (N/mm) |
RT/72h | To SUS 316L | 0.95 | 0.53 | 0.81 |
|
180° Peel Strength (N/mm) |
65 °C/ 90% RH/T72 Test at RT | To SUS 316L | 2.25 | 0.8 | 0.87 |
| 65 °C/ 90% RH/T72 Test at -20°C | To SUS 316L | 2.59 | 1.52 | 2.15 | |
|
180° Peel Strength after Electric Debonding (9V/30s) (N/mm) |
RT | To Al | 0.0008 | 0.0008 | / |
| 65 °C/ 90% RH T72 | To Al | 0.0036 | 0.0036 | / | |
| 65 °C/ 90% RH T168 | To Al | 0.0502 | 0.0427 | / | |
| Shock Drop (times) | RT/1.5 m | Al/ Matte Black PET | >100 | >100 | |
| 65 °C/ 90% RH T72 1.5m | Al/ Matte Black PET | >100 | >100 | ||
Featuring high bonding strength on electrically conductive substrates and can be subsequently de-bonded by applying a DC electrical potential across the electric release tape for a short time.
Temporary fixing for processing where components are too sensitive to heat for thermal release adhesive or blocking transmission of UV radiation for UV release adhesive.
Electrical release tape can be reused for 2-3 times.
Excellent electric debonding performance after aging.
Excellent drop resistance.
