Products
Thermal Materials
Thermal Interface Materials (TIMs)
EMI Shielding and Grounding Tapes
Thermal Pad Working Mechanism
Production Line
Test Method and Equipment
Technology Superiority
◆ High thermal conductivity
◆ Specialized silicone chemistry provides good electrical insulation
◆ Precise coating and hot-press molding technology
◆ Good thermal stability whatever ultra-thin or ultra-thick material
◆ Rapid and efficient service for making sample and die-cutting
◆ Instant customization in color, thickness, hardness or thermal conductivity
◆ Can be laminated with adhesive upon request
◆ Can be one-sided tacky upon request
Product Superiority
◆ Instant customization for thickness ( 0.1mm ~~ 15.0 mm) and color
◆ Special fillers to achieve specific thermal conductivity: 1.5 W/(m.K) ~~ 17 W/(m.K)
◆ Good electrically insulation, withstand voltage exceed 10(KV/mm), up to 17(KV/mm)
◆ Offer excellent conformability to cover uneven and rough surfaces
◆ Easy to fit diversified gap conditions. Avoid hard contact and protect IC chips
◆ Elastomeric property to provide mechanism balance
◆ Adhesive or natural self-tacky to stick on heat sink
Product Structure
◆ Base material: Silicone
◆ Filler: Boron nitride, Diamond, Aluminum nitride, Aluminum oxide, etc.
◆ Flame resistance: Metal hydroxide
◆ Additive: Colorant, Catalyst
◆ Application Design
Coding Principle
Typical Properties
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