Products
Foam Materials
Thermal Interface Materials (TIMs)
EMI Shielding and Grounding Tapes
Polyplate™ Microcellular Polymer Foam TS Series is an ultra-thin, high performance foam for cushioning, protective sealing, and long-term gap filling in electronic devices. PF-TS Series has very low compression set, high sealing performance, and excellent impact absorption. The standard color is black with other colors available upon request. PF-TS Series is coated with an embossed micro channel adhesive to allow air to vent from between the adhesive and substrate during application.
| P/N |
Thickness with adhesive (mm) |
Foam Thickness (mm) |
Density (kg/m³) |
25% Compression Force Deflection (psi) |
Compression Set (%) |
Suggested Max. Compression Ratio (%) |
180o Peel Strength (N/25mm, SUS) |
Continuous Use Temperature(℃ ) |
|---|---|---|---|---|---|---|---|---|
| PF010-TS | 0.1 | 0.07 | 500 | 0.71 | <5 | 40 | >3 | 70 |
| PF015-TS | 0.15 | 0.12 | 350 | 0.57 | <5 | 50 | >3 | 70 |
| PF020-TS | 0.2 | 0.17 | 350 | 0.57 | <5 | 50 | >3 | 70 |
|
Test Method |
ASTM D3574 |
ASTM D3574 | ASTM D3330 | SAE J-2236 |
Note: Ultra thin W/O adhesive is available upon request
The thickness can be customized by request
