Excellent compression performance
Excellent XY axis thermal spreading performance
Excellent XY axis thermal spreading performance and cushion performance
Both electrically and thermally conductive
Ultra-low thermal conductivity
Protect IC from heat shocking
EM-ABH300
Dispensable Absorber
single part dispensable silicone absorber
Ultra thin
High permeability
High Q factor and signal-to-noise ratio
Good flexibility
Excellent electrical insulation
Superior temperature ressitance
Ultra thin
High permeability
Excellent EMI noise absorption and suppression Performance
Good flexibility
Superior temperature resistance
Excellent noise absorption and suppression performance
Characteristic absorption frequency
Superior temperature resistance
Good thermal conductivity
Excellent EMI noise absorption
Good flexibility
High electrical insulation performance
Compressible
Low hardness
Inherent tacky
EMI sheilding and grounding with high degree dust and moisture protection
Suitable for fixed-gasket applications
Higher temperature resistance than WF series
Reflow solderable gasket can be customised by request
Thermal Interface Materials (TIMs)
EMI Shielding and Grounding Tapes
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